Honor X5 Plus - Spesifikasi
JARINGAN
| Teknologi | GSM / HSPA / LTE |
| 2G | GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2 |
| 3G | HSDPA 850 / 900 / 1900 / 2100 |
| 4G | LTE |
| Kecepatan | HSPA, LTE |
UMUM
| Diumumkan | 2023, August 16 |
| Status | Available. Released 2023, August |
| Dimensi | 163.3 x 75.1 x 8.4 mm (6.43 x 2.96 x 0.33 in) |
| Berat | 188 g (6.63 oz) |
| SIM | Dual SIM (Nano-SIM, dual stand-by) |
LAYAR
| Tipe | TFT LCD, 90Hz |
| Ukuran | 6.56 inches, 103.4 cm2 (~84.3% screen-to-body ratio) |
| Resolusi | 720 x 1612 pixels, 20:9 ratio (~269 ppi density) |
PLATFORM
| OS | Android 13, MagicOS 7.1 |
| Chipset | Mediatek Helio G36 (12 nm) |
| CPU | Octa-core (4x2.2 GHz Cortex-A53 & 4x1.6 GHz Cortex-A53) |
| GPU | PowerVR GE8320 |
MEMORI
| Slot Kartu | microSDXC |
| Internal | 64GB 4GB RAM |
KAMERA
| Utama | 50 MP, f/1.8, (wide), PDAF 2 MP, f/2.4, (depth) |
| Fitur | LED flash, HDR, panorama |
| Video | 1080p@30fps |
| Depan | 5 MP, f/2.2, (wide) |
KONEKTIVITAS
| WLAN | Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct |
| Bluetooth | 5.1, A2DP, LE, aptX HD |
| GPS | GPS, GLONASS, GALILEO, BDS |
| NFC | Yes (market/region dependent) |
| Radio | Unspecified |
| USB | USB Type-C 2.0, OTG |
FITUR
| Sensor | Fingerprint (side-mounted), accelerometer, proximity |
BATERAI
| Detail | Li-Po 5200 mAh, non-removable |
LAIN-LAIN
| Warna | Cyan Lake, Midnight Black |
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