Honor X8b - Spesifikasi
JARINGAN
| Teknologi | GSM / HSPA / LTE |
| 2G | GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2 |
| 3G | HSDPA 850 / 900 / 1900 / 2100 |
| 4G | LTE |
| Kecepatan | HSPA, LTE |
UMUM
| Diumumkan | 2023, December 14 |
| Status | Coming soon. Exp. release 2023, December 22 |
| Dimensi | 161.1 x 74.6 x 6.8 mm (6.34 x 2.94 x 0.27 in) |
| Berat | 166 g (5.86 oz) |
| SIM | Dual SIM (Nano-SIM, dual stand-by) |
LAYAR
| Tipe | AMOLED, 90Hz, 1200 nits (HBM), 2000 nits (peak) |
| Ukuran | 6.7 inches, 108.0 cm2 (~89.9% screen-to-body ratio) |
| Resolusi | 1080 x 2412 pixels, 20:9 ratio (~394 ppi density) |
PLATFORM
| OS | Android 13, MagicOS 7.2 |
| Chipset | Qualcomm SM6225 Snapdragon 680 4G (6 nm) |
| CPU | Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) |
| GPU | Adreno 610 |
MEMORI
| Slot Kartu | No |
| Internal | 128GB 8GB RAM, 256GB 8GB RAM, 512GB 8GB RAM |
KAMERA
| Utama | 108 MP, f/1.8, 24mm (wide), 1/1.67", PDAF 5 MP, f/2.2, (ultrawide) 2 MP, f/2.4, (macro) |
| Fitur | LED flash, HDR, panorama |
| Video | 1080p@30fps |
| Depan | 50 MP, f/2.1, (wide) |
KONEKTIVITAS
| WLAN | Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct |
| Bluetooth | 5.0, A2DP, LE |
| GPS | GPS, GLONASS, GALILEO, BDS |
| NFC | No |
| Radio | No |
| USB | USB Type-C 2.0, OTG |
FITUR
| Sensor | Fingerprint (side-mounted), accelerometer, compass |
BATERAI
| Detail | Li-Po 4500 mAh, non-removable |
LAIN-LAIN
| Warna | Glamorous Green, Titanium Silver, Midnight Black |
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