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Product Image
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Product Name
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Honor Pad X7
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JARINGAN
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Teknologi
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No cellular connectivity
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2G
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N/A
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3G
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N/A
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4G
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N/A
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GPRS
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No
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EDGE
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No
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UMUM
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Diumumkan
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2025, July 24
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Status
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Available. Released 2025, July 24
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Dimensi
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211.8 x 124.8 x 8 mm (8.34 x 4.91 x 0.31 in)
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Berat
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365 g (12.87 oz)
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SIM
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No
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LAYAR
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Tipe
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IPS LCD, 90Hz, 500 nits, 625 nits (HBM)
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Ukuran
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8.7 inches, 214.9 cm2 (~81.3% screen-to-body ratio)
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Resolusi
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800 x 1340 pixels, 5:3 ratio (~179 ppi density)
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PLATFORM
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OS
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Android 15, MagicOS 9
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Chipset
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Qualcomm SM6225 Snapdragon 680 (6 nm)
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CPU
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Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
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GPU
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Adreno 610
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MEMORI
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Slot Kartu
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microSDXC
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Internal
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128GB 4GB RAM
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KAMERA
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Utama
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8 MP, f/2.0, AF
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Fitur
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HDR
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Video
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1080p@30fps
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Depan
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5 MP, f/2.2
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KONEKTIVITAS
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WLAN
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Wi-Fi 802.11 a/b/g/n/ac, dual-band
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Bluetooth
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5.0, A2DP, LE
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GPS
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No
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NFC
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No
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Radio
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No
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USB
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USB Type-C, OTG
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